用于對切割縫隙要求比較小的手機(jī)面板及多晶硅等產(chǎn)品。主要厚度：0.3mm,0.4mm 外徑尺寸和中孔安裝尺寸可根據(jù)用戶要求定制。

??Used for mobile phone panels and polycrystalline silicon products that require relatively small cutting gaps.Main thickness:0.3mm,0.4mm,outer diameter size and middle hole installation size can be customized according to user requirements.