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      >Laserino二合一激光綜合測量系統

      Laserino二合一激光綜合測量系統

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      光傲科技股份有限公司

      美國

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      產品介紹

      業界首臺基于波前探測技術的,全面同時測量激光光束laser beams、光斑分布beam-profiling 的二合一激光測試設備。全面評價激光品質:
      • 基于波前分析的激光失常測試Aberrations obtained from the wavefront sensor
      • M² 測試,通過光斑光強分布得到measurement of the beam-quality using the beam-profiler
      • 激光束腰,位置、發散角Measurement of beam-waist, position of beam-waist and divergence angle
      • 高斯形貌Fit of Gaussian profile to image
      • 在線調整激光,對焦、對準Real-time adjustment of laser (up to a speed of 900 Hz using a sub-window)
      • 對激光元件,透鏡、鏡片測試Measure the optical quality of lenses, mirrors etc

      有兩種型號以適合不同波長使用 0.4 μ to 1.1 μ and NIR 0.9 μ to 1.7 μ

      Laserino-Pro-Vis

      • Wavefront sensor with fixed collimator that can be used in external illumination mode in white-light or laser
      • Two uncooled cameras allow the complete control of laser beam: the first camera is used for wavefront analysis , the second camera for imaging beam-profile of laser
      • Front flange allows easy mounting and dismounting of lenses and collimators
      • Standard sampling: 30 x 30 spots
      • For testing lasers from 0.4 μ to 1.1 μ
      • Φ max=6.7mm (without beam-expander)
      • Φ max=58.0mm (with BE60)

      Laserino-ProIR

      • Wavefront sensor that can be used in external illumination mode with laser
      • One uncooled Lead oxysulfide Vidicon camera can be switched from wavefront analysis to beam-profiler to get a complete picture of the laser beam
      • Front flange allows easy mounting and dismounting of lenses and collimators
      • Maximum sampling: 20 x 20 spots
      • For testing lasers from 0.4 μ to 1.8 μ; optimized in the wavelength range:

        0.7 μ to 1.8 μ

      • Φ max = 8.0 mm (without beam-expander)
      • Φ max = 58.0 mm (with BE60)

      Sensoft: The wavefront sensor based instrument comes with Sensoft Laserino, the Shack-Hartmann wavefront sensor control and analysis software optimized for laser. The package is available under any Windows operating system (2000/XP).

      • All the features of Optino-EE30
      • Laser beam 3D and contour profile in real-time
      • Fit of Gaussian profile to image
      • Best focus determination based on analysis of beam diameter
      • Real-time adjustment of laser (up to a speed of 900Hz using a sub window)
      • M² measurement of the beam-quality using the beam-profiler
      • Measurement of beam-waist, position of beam-waist and divergence angle
      Laserino 激光波前測試技術指標
      Feature Specification
      Type of element that can be tested Lasers from 0.4 μ to 1.1 μ with Laserino-ProVis wavefront sensor

      Lasers from 0.9 μ to 1.7 μ with Laserino-ProNIR wavefront sensor

      Optical elements with external illumination

      Diameter of optical element that can be tested(1) Practically any diameter
      Diameter of lenslets(2) 0.2 mm
      Focal length of lenslets(3) 22 mm for Laserino-ProVis wavefront sensor, 11 mm for Laserino-ProNIR wavefront sensor
      Standard sampling on the pupil(4) 30 x 30 spots
      Maximum sampling(5) 100 x 100 spots with large format camera
      Analysis Software Sensoft
      Repeatability of measurement of Zernike polynomials(6)< λ/300 rms
      Rms repeatability of wavefront measurement(7)< λ/200 rms
      Absolute precision(8) Depends on the surface quality of the reference optical element. Typically λ/20 - λ/100
      Wavelength range (visible camera)(9) 0.375 μ - 1.1 μ with standard camera
      Wavelength range (IR camera)(10) 0.9 μ - 1.7μ
      Tilt measurement accuracy (angle depends on the size of the optical elements) 4 μ rad
      Dimensions 9 (H) x 22 (L) x 9 (W) cm.
      Power requirement (Vis Fiber optic light source) 120V or 220V
      Power requirement (stepper motor) 12 V, 500 ma.
      Height of optical axis from base 65.5 mm
      Notes and explanations for the specifications table:

      (1) With the appropriate auxiliary optics, optical elements of almost any diameter can be tested

      (2) Lenslets with different diameters available on request

      (3) Lenslets with different focal lengths available on request

      (4) With the standard CMOS camera (chip size 6.8 x 8.6 mm²). Pixel size: 6.7μ

      (5) Depends on the chip size of the camera. In Optino wavefront sensor, the camera is mounted externally, and can be changed easily.

      For details, see separate section

      (6) Repeatability of measurement obtained by combining 100 SH images taken in succession. The error of this coefficient

      depends on the sampling used for obtaining the SH image

      (7) Repeatability of measurement obtained by combining 100 SH images taken in succession

      (8) This will determine the final accuracy of the measurements, as the SH test is a differential test

      (9) Other cameras with an extended range can be used

      (10) Other cameras with an extended range can be used

      激光光斑、光束分析技術指標
      Feature Specification
      Type of element that can be measured Lasers from 0.4 µ to 1.1 µ with Laserino-ProVis wavefront sensor

      Lasers from 0.9 µ to 1.7 µ with Laserino-ProNIR wavefront sensor

      Resolution of imaging lens motor 21 µ per step
      Accuracy of determination of beam waist diameter ± 2 %
      Accuracy of determination of beam waist location ± 8 % of beam Rayleigh distance
      Accuracy of determination of M2 : Beam quality ± 5 %
      Accuracy of determination of divergence angle ± 5 %
      Divergence range measurement 632 nm 0.5 mrad to 20.0 mrad (with beam-expander)
      Divergence range measurement 1550 nm 1.2 mrad to 50.0 mrad (with beam-expander)
      Max Beam diameter 23 mm
      Clip levels User selected (continuously variable)
      Diameter computation Gaussian or second moment

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