【介紹參數】

1. 獨立四電機驅動     Independent 4 Drives

_ 為**方案提供更多選擇     Provides much option for the best recipe

_ 圖形易于修改         Easy to correct platen figure

2. 研磨盤冷卻系統    Plate Cooling Structure(CMP)

_ 該結構可以很大程度上降低機械拋光過程中溫度升高對砂輪平面度造成的影響

Maintain Plate flatness management against heat during mechanical polishing.

3. 低振動    Low vibration

_ 高剛性鑄鐵機身，減少加工震動        Provides stable run for thin applications

4. Hydrostatic base facing unit(DMP)

_ 平面度可達5um以內          Always guarantee the best flatness within 5um

_ 時間節約:尺寸自動補償系統        Time saving : Self re-conditioning when necessary

5. 壓力控制系統        Air Tube Type pressure control system

_ 加工超薄和易碎產品時可以提供更精確的壓力控制

Provides the suitable pressure control for thin & fragile applications

_ 出色的壓力控制系統，可將加工壓力均勻分配至砂輪盤所有晶片

Excellent resolution of upper pressure Balanced pressure to all batched wafers

6. 采用德制傳輸系統       German made transmission applied

_ 設備耐用度有保證         Guaranteed machine durability

_ 低故障率 ，低輪齒間隙        Low trouble & Less back-lash